SPEL’s IC Assembly facility caters to the lead-frame based packages with small to medium pin-counts. Equipped with latest assembly equipment to handle wafers up to 12inches, its integrated facility is a one stop destination for Customer’s packaging needs in QFN and Gull-wing leaded packages.

SPEL offers wide-ranging packaging options that Customer can choose from. SPEL can also partner with Customers in tooling up new packages in Cost Effective manner its unique Engineering Expertise.

Having Certified with ISO9001 and TS16949, the assembly facility has the robust Quality System and procedures in place to meet challenging industry requirements.