|
Bill of Materials |
|
|
|
SOIC (300 MILS) |
|
Leadframe |
A194(Cu) |
|
Die Attach |
Conductive Epoxy 84-1LMIS R4 / CRM1076NS |
|
Wire Bond |
Gold wire 1.0 / 1.2 mil |
|
Molding compound |
EME 6600CA / G600 |
|
Marking |
White Ink / Laser |
|
Lead Finish |
Solder plate ( Sn/Pb : 85/15 ) & ( Sn/Pb :
99.99/0) |
|
Packing |
Antistatic Tubes / Reels / Pouches |
|
