Natronix : SPEL : Reliability

Package Reliability

Reliability tests are prerequisite before releasing any Integrated Circuit product to the market by the Chip Manufacturers. Various environmental stress tests simulate different failure modes. The significance of these tests is to accelerate the failure mechanism, which could happen during the intended life cycle of the product.

SPEL established a comprehensive reliability monitoring program in accordance with the JEDEC and MIL-STD-883 standards. These tests are conducted during New Package Qualification. SPEL also does these tests semi-annually on all the packages on sample basis to ensure the outgoing product quality.

Environmental Reliability Stress Test


1.	Highly Accelerated Temperature and Humidity Stress Test

2.	Unbiased Pressure Pot Test

3.	High Temperature Storage Life Test

4.	Steady State Temperature Humidity Bias Life Test

5.	High Temperature Operating Life Test

6.	Temperature Cycling Test

7.	Low Temperature Storage Life Test

8.	Preconditioning Tests

9.	MSL Tests



Mechanical Test

1.	Solderability Test

2.	Lead Integrity Test

3.	Test Wire Bond Pull Strength Test

4.	Solder Reflow Test

5.	Drop Test

6.	Wire Bond Shear Test

7.	Whisker Test Analysis

8.	Resistance To Solder Heat Temperature