Natronix provides turnkey solutions that include Semiconductor Assembly & Test Services (SATS) and drop-shipment services. As integrated circuits increase in speed and complexity, the right semiconductor packaging becomes critical to ensure optimal system performance. Natronix offers tailored application-specific, assembly and test solutions.

Collaborating with Customers and leading OEMs to develop comprehensive package solutions it makes it easier for next-generation semiconductors to be designed into next-generation end products. By sharing device, package and product roadmaps we enable our Customers and their Customers to accelerate the development and deployment of new microelectronic applications.

Focusing on our core competencies allows our Customers to optimize their assets and reduce time-to-sales. Customers get accelerate time-to-revenue for their new products.

These services along with several others such as Die Processing, Package Signal Integrity Analysis, Failure Analysis, Qualification Testing,
Engineering Support make Natronix a valuable link in the Customers supply chain.